Electronic packaging and thermal management materials
              National Engineering Technology Research Center for Nonferrous Metals Composites mainly engaged in the research of the third and fourth generation thermal management materials with high thermal conductivity and low coefficient of thermal expansion including SiCp/Al,SiCp/Cu, Diamond/Al, Diamond/Cu and the development of the device. We devote continuously to solve the problem of radiating in electron device through the integrated design of material structure and extend these thermal management materials to other fields. The performance of products we have studied are comparable to similar foreign products. And the application research have ranked in the top of the domestic institutions. These thermal management materials have successfully applied to such fields as laser bar, microwave power device and semiconductor illumination apparatus.

              Diamond/Cu material is an outstanding material in electronic packaging and thermal management. And its thermal conductivity can reach 550 W/(mK) with the low coefficient of thermal expansion 6~7×10-6/K.

              Properties Table

              Properties
              SiC/Al
              Diamond/Cu
              Thermal conductivity
              W/mK
              170~200
              500
              Density
              g/cm3
              <3.0
              <6
              CTE
              ppm/K
              6.9~9.7
              6.2~7.0
              Bending strength
              MPa
              300
              350
              Tensile strength
              MPa
              160
              180

              Dr. CHEN

              Cel:13811270019

              Tel: 010-82241260

              Fax: 010-62355099

              E-mail:ccs@grinm.com

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